Developing energy-efficient, high-bandwidth electrical and photonic links to provide the backbone for Theme 3's backhaul networks connecting mmWave radio heads. The theme brings together prominent researchers in the areas of photonic devices, high-speed serial link integrated circuit design, and photonics systems and signal processing.
The researchers engaged in Theme 2 will collaborate on a systems-to-devices research agenda to address the problem of next-generation connectivity. The research activities of Theme 2 will drive towards integration within Theme 1's center-wide Socket-to-Socket Distributed AI/ML/HPC Fabric Platform (SoSFab).
Overall, Theme 2 is focused on developing new technologies and approaches to improve connectivity by developing energy-efficient, high-bandwidth electrical and photonic links that can support next-generation wireless networks. The theme's research activities are closely coordinated with those of Themes 1 and 3 to ensure that all aspects of the connectivity challenge are addressed.