Theme 3 – Wireless Circuits and Technology

Theme 3 of CUbiC is focused on addressing the problem of next-generation wireless connectivity by bringing together prominent researchers in the areas of RF and mmWave circuits, high-speed analog and mixed-signal processing, and experts in III-V device design and fabrication. The researchers engaged in Theme 3 will collaborate on a circuits-to-devices research agenda to develop new technologies and approaches to improve wireless connectivity. 

The collaborations with Themes 1 and 2 will be coordinated through cross-cutting research tasks, benefiting from faculty with overlapping areas of expertise. The goal of Theme 3 is to develop new technologies that can address the challenges of next-generation wireless connectivity, including improving data rates, reducing latency, and increasing energy efficiency. 

Overall, Theme 3 is focused on developing new technologies and approaches to improve wireless connectivity by bringing together experts in RF and mmWave circuits, high-speed analog and mixed-signal processing, and III-V device design and fabrication. The theme's research activities are closely coordinated with those of Themes 1 and 2 to ensure that all aspects of the connectivity challenge are addressed.

Principal Investigators